podcasts Market Intelligence /marketintelligence/en/news-insights/podcasts/next-in-tech-episode-147.xml content esgSubNav
In This List
Podcast

Next in Tech | Episode 147: Chilling at the OCP

Podcast

Private Markets 360 - Episode 17: European Credit Opportunities

Blog

Engineering and Construction Cost Indicator declined in September as cost increases for materials and equipment moderate

Podcast

Next in Tech | Ep. 186: B2B Payments Technology and Markets

Video

FTF News interview with Brittany Garland: Best Outsourcing Provider 2024

Listen: Next in Tech | Episode 147: Chilling at the OCP

Increasing power densities in the devices that are populating datacenters are pushing their cooling capabilities to new technologies. Perkins Liu returns to dig into liquid cooling and progress at the Open Compute Summit with host Eric Hanselman. The OCP is working on extending its ecosystem efforts to liquid cooling as generative AI and other high performance computing uses look to leverage its greater capacity and sustainability. High powered GPU’s are driving direct to chip cooling.

Subscribe to Next in Tech
Subscribe

No content (including ratings, credit-related analyses and data, valuations, model, software or other application or output therefrom) or any part thereof (Content) may be modified, reverse engineered, reproduced or distributed in any form by any means, or stored in a database or retrieval system, without the prior written permission of Standard & Poor's Financial Services LLC or its affiliates (collectively, S&P).